Description
>Adopts high-quality 3D NAND wafer level chip> Supports PCIe3.0 x4, and NVMe 1.3 protocol> All-metal cooling plate is included; equipped with intelligent temperature control technology> Supports TRIM to improve read/write performance and speed> Supports Max. Write technology for full-disk SLC cache> Supports LDPC ECC> Low power consumption management
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